Advanced Electronic Packaging: With Emphasis on Multichip Modules (IEEE Press Series on Microelectronic Systems)Advanced Construction Technology News]

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One Response to Advanced Electronic Packaging: With Emphasis on Multichip Modules (IEEE Press Series on Microelectronic Systems)Advanced Construction Technology News]

  • Anonymous says:
    0 of 2 people found the following review helpful
    5.0 out of 5 stars
    A book for everyone from a Novice to an Expert., August 28, 2000
    By A Customer
    This review is from: Advanced Electronic Packaging: With Emphasis on Multichip Modules (IEEE Press Series on Microelectronic Systems) (Hardcover)
    I am a student of Dr. Brown. I must emphasize that the book that he has edited and a part of which he has written, is just excellent in its quality and quantity. By quality I mean its the best book on packaging that I have read and by quantity I mean the book has something on everything. Most of the books are like a lot on a topic and very less on most of the other topics, but this book surpasses everything. It treats every chapter fairly and equally. The book will not make one an expert in packaging, but would surely make one fell satisfied with the content and knowledge. I hope that other readers too would find this book good and informative.
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